Thick Plate Cutting
Advanced techniques and optimized parameters for cutting thick plates (20-50mm) with high-power fiber laser systems.
Thick Plate Process Overview
Cutting thick plates (>20mm) requires careful optimization of multiple parameters simultaneously. Unlike thin materials, thick plate cutting is dominated by melt flow dynamics rather than beam absorption.
Critical Parameters
| Parameter | Thin (<6mm) | Medium (6-20mm) | Thick (20-50mm) |
|---|---|---|---|
| Focus Position | -1mm to -2mm | -3mm to -6mm | -6mm to -15mm |
| Nozzle Diameter | 1.2-1.5mm | 1.5-2.5mm | 2.5-3.5mm |
| Gas Pressure (O₂) | 0.4-0.6 bar | 0.6-1.0 bar | 1.0-1.5 bar |
| Duty Cycle | 100% | 100% | 80-100% (pulsed) |
Techniques for Improved Thick Plate Cuts
Multi-Pass Cutting
For materials >30mm, consider multiple passes at increasing depth:
- Pass 1: Full power, wide focus (-5mm), low speed — creates pilot kerf
- Pass 2: Full power, deep focus (-12mm), reduced speed — completes cut
Adaptive Feed Rate
Reduce speed in corners and tight radii to maintain consistent thermal input:
- Straight sections: Maintain full speed
- Radius < 5mm: Reduce to 60% speed
- Sharp corners: Reduce to 40% speed
Thick plate key insight: The single most important parameter for thick plate cutting is focus position. For plates over 20mm, the optimal focus is typically at 60-80% of the material thickness below the surface. Too shallow and the bottom won't penetrate; too deep and the top edge quality suffers. Use a focus calibration test on scrap material before production runs.
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