Thick Plate Cutting
Advanced techniques and optimized parameters for cutting thick plates (20-50mm) with high-power fiber laser systems.
Thick Plate Process Overview
Cutting thick plates (>20mm) requires careful optimization of multiple parameters simultaneously. Unlike thin materials, thick plate cutting is dominated by melt flow dynamics rather than beam absorption.
Critical Parameters
| Parameter | Thin (<6mm) | Medium (6-20mm) | Thick (20-50mm) |
|---|---|---|---|
| Focus Position | -1mm to -2mm | -3mm to -6mm | -6mm to -15mm |
| Nozzle Diameter | 1.2-1.5mm | 1.5-2.5mm | 2.5-3.5mm |
| Gas Pressure (O₂) | 0.4-0.6 bar | 0.6-1.0 bar | 1.0-1.5 bar |
| Duty Cycle | 100% | 100% | 80-100% (pulsed) |
Techniques for Improved Thick Plate Cuts
Multi-Pass Cutting
For materials >30mm, consider multiple passes at increasing depth:
- Pass 1: Full power, wide focus (-5mm), low speed — creates pilot kerf
- Pass 2: Full power, deep focus (-12mm), reduced speed — completes cut
Adaptive Feed Rate
Reduce speed in corners and tight radii to maintain consistent thermal input:
- Straight sections: Maintain full speed
- Radius < 5mm: Reduce to 60% speed
- Sharp corners: Reduce to 40% speed
Thick plate key insight: The single most important parameter for thick plate cutting is focus position. For plates over 20mm, the optimal focus is typically at 60-80% of the material thickness below the surface. Too shallow and the bottom won't penetrate; too deep and the top edge quality suffers. Use a focus calibration test on scrap material before production runs.
Still Having Piercing Problems?
Our team of laser cutting specialists is ready to help you optimize your cutting process. Send us your material specs and we'll provide a tailored solution.
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